Thermally conductive glue for electronics

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Thermal adhesive is a type of thermally conductive glue used for electronic components and heat sinks. It can be available as a paste (similar to thermal paste) or as a double-sided tape.[1]

It is commonly used to bond integrated circuits to heatsinks where there are no other mounting mechanisms available.

The glue is typically a two-part epoxy resin (usually for paste products) or cyanoacrylate (for tapes).[2] The thermally conductive material can vary including metals, metal oxides, silica or ceramic microspheres. The latter are found in products that have much higher dielectric strength, although this comes at the cost of lower thermal conductivity.

End-user modding heatsinks may be supplied with thermal adhesive attached (usually a piece of tape). For products sold through electronic components distributors this is rarely the case; the adhesives are sold separately to professionals.

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Heat Sink Extrusions

Extrusion Heat Sinks & Profiles for Cost Effective Cooling Solutions

ATS offers a wide variety of ultra-performance straight fin, slant fin, and pin fin extruded heat sinks. These high aspect ratio heat sinks are ideal for applications where there is adequate airflow to take optimum advantage from these designs. ATS also offers an array of heat sink extrusion profiles with different thermal performances, fin-to-fin spacing, lengths and heights. Extrusion profiles enable engineers to either select or start their design from a pre-tooled extrusion profile for the cooling solution. ATS&#; extrusion profiles are available in straight fin, STAR LED and linear LED designs without any surface treatment and can be customized for different application requirements at ATS&#; manufacturing facilities.

Slant Fin Extrusions
Ultra-performance Slant Fin heat sinks are available for component sizes 10x10mm to 60x60mm. Heat sink height ranges from 2-25mm in 1mm increments. The Slant Fin design offers additional surface area, and therefore higher performance for applications that can accommodate larger fin-to-fin spacing. Because they are fabricated from extruded aluminum, Slant Fin heat sinks have minimal thermal resistance from their base to their fins, and are lightweight. These heat sinks can be attached to a device with double-sided thermal adhesive tapes, Z-clips or the secure maxiGRIP&#; technology.

Extrusion Profiles
Extruded aluminum heat sinks are the most cost-effective solutions for most electronic cooling applications. ATS offers a wide variety of aluminum profiles for custom heat sink fabrication and other applications. ATS extrudes its heat sink profiles from high performance, smooth surface aluminum alloy . Standard bar lengths are 300mm (11.8in), for easy, cut-to-length fabrication of prototypes and custom sizes. There are no minimum order quantities, and no NRE tooling costs applied. Thermal performance data is consistent per inch of extrusion length.

Pin Fin Extrusions
Pin Fin extrusions are ideal cooling solutions for spatially constrained PCB layouts when the airflow direction near the device is ambiguous. Pin Fin heat sinks have high aspect ratios for applications where there is adequate airflow to take optimum advantage from these designs. The pin fin layout provides low pressure drop characteristics. The combined large surface areas of the pins and base increases overall heat sink performance. Heat sink solutions are available for component sizes 10x10mm to 60x60mm. Heat sink height ranges from 2-25mm in 1mm increments. These heat sinks can be attached to devices with double-sided thermal adhesive tapes, Z-clips or the secure ATS maxiGRIP&#; technology.

Straight Fin Extrusions
ATS Straight Fin extruded aluminum heat sinks are available for component sizes 10x10mm to 60x60mm. Heat sink heights range from 2-25mm in 1mm increments. Their high aspect ratio means there is a greater density of fins in a given footprint than more common heat sinks. The Straight Fin design offers an excellent cooling solution for spatially constrained PCB layouts. The ratio of tall, straight fins to their small footprint base improves thermal performance and saves space. The extruded aluminum minimizes thermal resistance, reduces weight and saves cost over alternative (e.g. copper) heat sinks. These heat sinks can be attached to a device with double-sided thermal adhesive tapes, Z-clips or ATS secure maxiGRIP&#; technology.

LED Extrusions
ATS STAR LED heat sinks are used across the globe because of their energy-saving advantages. An LED&#;s performance, similar to any other semiconductor device, is temperature sensitive. Higher temperatures cause degradation in the working life and light emittance of the LED. STAR heat sinks enable designers to cool their LED lights for their highest performance and efficiency. ATS offers a complete line of high performance cooling solutions based on its patented maxiFLOW&#; high performance design to cool LED-based round down lights and similar designs. Each STAR series extruded aluminum heat sink is made from lightweight, anodized aluminum for maximum thermal performance. Its base includes inner and outer threads for attaching lens mounts, brackets and other hardware. Standard STAR LED heat sink lengths are 18-mm (0.7-39in), and they can be cut to any length.

Contact us to discuss your requirements of aluminum profile types. Our experienced sales team can help you identify the options that best suit your needs.