SMT /SMD /THT /THD

Fundamentally, there is a difference between surface-mount technology (SMT) and surface-mount device (SMD). It is because one is a process, whereas the other is a device.

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SMT is the method of placing components (like an SMD) on the board. Here, a calculated amount of solder paste is applied to the board. Then, the pick-and-place machine is used to mount the SMD component onto the board.

An SMD is an electronic component that can be found on a Printed Circuit Board (PCB). It is designed to be mounted directly on PCB

If you want to learn more, please visit our website Smd to Tht.

Through-hole-technology (THT) involves inserting leads of components into drilled holes in the PCB. Leads can then be soldered onto pads or lands on the solder side of the board, usually with a simple soldering iron by hand or wave soldering process. Soldering a Dual-in-line package (DIP) IC on the PCB is an example of THT.

THT is the method of inserting leads of components into drilled holes in the PCB.THD is an electronic component that can be found on a PCB .Its designed to be inserted directly into PCB.

I think that many experienced people will agree that in most cases the advantage is with surface mount. These days the SMT components are cheaper and smaller. Once you learn how to work with them, so long as you avoid the tiny/fine pitch parts, rework of SMT can be easier than removing THT components and clearing the holes of solder. SMT components permit lower stray inductance which is important in high frequency power conversion. Even when handling moderate amounts of power, I think that these days most of the advantages lie with SMT.

Through hole is often better for high power or when you want axial components to work as jumpers. It is often helpful to have THT components on hand for manual circuit modifications which do not match the pcb artwork.

For more information, please visit Smd Vs Through Hole.